Project Outline Deadline 1 March 2019
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » organised by IMAPS, will be held in Grenoble, France, on WTC congress center on May 22-23, 2019.
MiNaPAD is a 2 days conference and an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community.
Deadline for papers: February 1st, 2019
Contact: imaps.france [@] imapsfrance.orgSee more